THERMAL SOCKET
LAYOUT KIT
Eliminating Thermal Drift
Enabling Reliable Test Results
See What’s Possible
Custom-fabricated interface between handler and test socket, operating up to 175 °C with active air circulation.
| Thermal SLK | Standard SLK | |
|---|---|---|
| Feature | Dual-Temp | Dual-Temp |
| Temperature Range | 25 – 130 °C | 25 – 175 °C |
| Cooling Capacity | Active Cooling 30W |
Not Available |
| Stability | ±3.0 °C | ±8.0 °C |
| Heater Type | Ceramic Heater | Cartridge Heater |
| Heating Capacity | Fast Ramp | Slow Rise |
| Temp Monitoring | RTD Realtime | RTD Realtime |
| Sites Supported | Up to 16 | Up to 16 |
Validate to real world operating conditions for High-performance Computing (HPC), Automotive, And 5G Devices
Supports 2, 4, 8, 12, and 16-site configurations to match different test throughput requirements.
Dedicated per site thermal control with closed-loop feedback maintaining ±3.0 °C stability, eliminating temperature drift.
Design to operates as standalone or integrated to handshake with leading handler, enabling flexible deployment without disrupting existing workflows.
Comprehensive validation from 15 °C to 130 °C for device sizes from 9mm2 to 400mm2, built for demanding HPC, Automotive and 5G applications.
CTE-matched materials ensure consistencies after millions of test cycles.
Built For
HPC
High Performance
Computing
AUTOMOTIVE
Power & ADAS
Electronics
5G / 6G
RF and
Communication Devices
THERMAL SOCKET
LAYOUT KIT
DYNAMIC AIRFLOW.
THERMAL PRECISION.
±3.0 °C
Stability
80 Hz
Monitoring
Active
Airflow
2-16
Sites
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Through a unique combination of engineering, construction and design disciplines and expertise.
