ADVANCED TESTING SOLUTION

THERMAL SOCKET
LAYOUT KIT

Eliminating Thermal Drift
Enabling Reliable Test Results

See What’s Possible

THERMAL SOCKET LAYOUT KIT

Custom-fabricated interface between handler and test socket, operating up to 175 °C with active air circulation.

Thermal SLK Standard SLK
Feature Dual-Temp Dual-Temp
Temperature Range 25 – 130 °C 25 – 175 °C
Cooling Capacity Active Cooling
30W
Not Available
Stability ±3.0 °C ±8.0 °C
Heater Type Ceramic Heater Cartridge Heater
Heating Capacity Fast Ramp Slow Rise
Temp Monitoring RTD Realtime RTD Realtime
Sites Supported Up to 16 Up to 16
Active Thermal Control

Validate to real world operating conditions for High-performance Computing (HPC), Automotive, And 5G Devices

CONFIGURABLE MULTI-SITE TESTING

Supports 2, 4, 8, 12, and 16-site configurations to match different test throughput requirements.

INDEPENDENT DIRECT COOLING

Dedicated per site thermal control with closed-loop feedback maintaining ±3.0 °C stability, eliminating temperature drift.

COMPATIBLE WITH LEADING HANDLER MODELS

Design to operates as standalone or integrated to handshake with leading handler, enabling flexible deployment without disrupting existing workflows.

WIDE THERMAL & PACKAGE COVERAGE

Comprehensive validation from 15 °C to 130 °C for device sizes from 9mm2 to 400mm2, built for demanding HPC, Automotive and 5G applications.

DURABLE MATERIALS SELECTION

CTE-matched materials ensure consistencies after millions of test cycles.

Interface Coverage Design

Built For

HPC

HPC

High Performance
Computing

AUTOMOTIVE

Power & ADAS
Electronics

5G / 6G

5G / 6G

RF and
Communication Devices

THERMAL SOCKET
LAYOUT KIT

DYNAMIC AIRFLOW.
THERMAL PRECISION.

±3.0 °C
Stability

80 Hz
Monitoring

Active
Airflow

2-16
Sites

Get in Touch

Through a unique combination of engineering, construction and design disciplines and expertise.

This field is for validation purposes and should be left unchanged.
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